Semiconductor structure and method for forming same

ABSTRACT

A semiconductor structure and a method for forming the same are provided. The method includes: providing a base; forming a to-be-etched material layer on the base; forming a mask material layer on the to-be-etched material layer; performing a first doping treatment on a partial region of the mask material layer, where after the first doping treatment is performed, the mask material layer includes a first mask-material-layer part and a to-be-removed second mask-material-layer part, and the first mask-material-layer part is a part that has undergone the first doping treatment or the second mask-material-layer part is a part that has undergone the first doping treatment; forming a first trench in the mask material layer, where the first trench is at least located in the first mask-material-layer part; removing the second mask-material-layer part, and forming a second trench in the remaining mask material layer; removing the to-be-etched material layer exposed from the first trench and the second trench, and forming a target pattern layer; and after the target pattern layer is formed, removing the remaining mask material layer. By using the present disclosure, the pattern precision of the first trench and the second trench is improved, and the pattern precision in the target pattern layer is correspondingly improved.

RELATED APPLICATIONS

The present application claims priority to Chinese Patent Appln. No.201910107844.9, filed Feb. 2, 2019, the entire disclosure of which ishereby incorporated by reference.

BACKGROUND Technical Field

Embodiments and implementations of the present disclosure relate to thefield of semiconductor manufacturing, and in particular, to asemiconductor structure and a method for forming same.

Related Art

With the rapid growth of the semiconductor integrated circuit (IC)industry, process nodes in the semiconductor technology has becomeincreasingly small according to Moore's law. Therefore, ICs haveincreasingly small volumes and become increasingly precise and complex.

In the development of ICs, generally, functional density (that is, thenumber of interconnected structures per chip) gradually increases whilegeometric size (that is, the size of the smallest component that can becreated using process steps) gradually decreases. Correspondingly, ICmanufacturing becomes more difficult and complex.

Currently, as technological nodes become increasingly small, it becomeschallenging to enable a pattern formed on a wafer to better match atarget pattern.

SUMMARY

One problem to be addressed by embodiments and implementations of thepresent disclosure is to provide a semiconductor structure and a methodfor forming same, to improve pattern precision.

To address the foregoing problem, one form of the present disclosureprovides a method for forming a semiconductor structure, including:providing a base; forming a to-be-etched material layer on the base;forming a mask material layer on the to-be-etched material layer;performing a first doping treatment on a partial region of the maskmaterial layer, where the first doping treatment is suitable forincreasing an etching selection ratio of the mask material layer thathas not undergone the first doping treatment to the mask material layerthat has undergone the first doping treatment, and after the firstdoping treatment is performed, the mask material layer includes a firstmask-material-layer part and a to-be-removed second mask-material-layerpart, and the first mask-material-layer part is a part that hasundergone the first doping treatment in the mask material layer, or, thesecond mask-material-layer part is a part that has undergone the firstdoping treatment in the mask material layer; after the first dopingtreatment is performed, forming, in the mask material layer, a firsttrench exposing a part of the to-be-etched material layer, where thefirst trench is at least located in the first mask-material-layer part;after the first trench is formed, removing the secondmask-material-layer part, and forming a second trench exposing a part ofthe to-be-etched material layer in the remaining mask material layer;removing the to-be-etched material layer exposed from the first trenchand the second trench, and forming a target pattern layer; and after thetarget pattern layer is formed, removing the remaining mask materiallayer.

Another form of the present disclosure further provides a semiconductorstructure, including: a base; a to-be-etched material layer, located onthe base; a mask material layer, located on the to-be-etched materiallayer, where the mask material layer includes a firstmask-material-layer part and a to-be-removed second mask-material-layerpart, the first mask-material-layer part has doping ions, or, the secondmask-material-layer part has doping ions; and a trench, located in themask material layer, where the trench is at least located in the firstmask-material-layer part.

Compared with the prior art, technical solutions in embodiments andimplementations of the present disclosure have the following advantages.

In embodiments and implementations of the present disclosure, using afirst doping treatment, a mask material layer is divided into a firstmask-material-layer part and a second mask-material-layer part, where anetching selection ratio of the first mask-material-layer part to thesecond mask-material-layer part is relatively large. After the firstdoping treatment is performed, a first trench is formed in the maskmaterial layer, where the first trench is at least located in the firstmask-material-layer part. After the first trench is formed, the secondmask-material-layer part is removed, and a second trench is formed inthe remaining mask material layer. Compared with a solution in which thefirst trench and the second trench are formed in a same step, inembodiments and implementations of the present disclosure, the firsttrench and the second trench are separately formed. In one aspect, theprocess window for forming the first trench and the second trench isincreased (for example, optical proximity effects are mitigated), sothat the pattern precision of the first trench and the second trench isensured. In another aspect, an etching selection ratio of the secondmask-material-layer part to the first mask-material-layer part isrelatively large, so that the process window for forming the secondtrench is further increased (for example, the second mask-material-layerpart may be removed by using maskless etching), thereby ensuring thepattern precision of the second trench. In conclusion, in embodimentsand implementations of the present disclosure, the pattern precision ofthe first trench and the second trench is improved. Correspondingly,after a to-be-etched material layer exposed from the first trench andthe second trench is removed to form a target pattern layer, the patternprecision in the target pattern layer is correspondingly improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings constitute a part of this specification,describe exemplary embodiments and implementations of the presentdisclosure, and are used to explain the principles of the presentdisclosure together with this specification. In the accompanyingdrawings:

FIG. 1 to FIG. 24 are schematic structural diagrams corresponding tosteps in one form of a method for forming a semiconductor structure; and

FIG. 25 and FIG. 26 are schematic structural diagrams of one form of asemiconductor structure.

DETAILED DESCRIPTION

Exemplary embodiments and implementations of the present disclosure aredescribed in detail with reference to the accompanying drawings. Itshould be understood that unless otherwise specifically described,relative arrangements, numerical expressions, and values of parts andsteps stated in these embodiments and implementations should not beunderstood as limitations to the scope of the present disclosure.

As can be seen from the related art, as technological nodes becomeincreasingly small, it becomes challenging to enable a pattern formed ona wafer to better match a target pattern.

It is found through research that the pitch between photoresist patternskeeps decreasing as technological nodes become increasingly small.However, under the influence of a photolithography process, when thepitch between adjacent photolithographic patterns is less than athreshold distance of the photolithography process, the photoresistpatterns tend to deform or distort. When the photoresist patterns aretransferred to a film layer to be patterned to form a target pattern(for example, a trench), pattern precision of the target pattern iscorrespondingly reduced.

To address the technical problem, in implementations of the presentdisclosure, using a first doping treatment, a mask material layer isdivided into a first mask-material-layer part and a secondmask-material-layer part, where an etching selection ratio of the firstmask-material-layer part to the second mask-material-layer part isrelatively large. After the first doping treatment is performed, a firsttrench is formed in the mask material layer, where the first trench isat least located in the first mask-material-layer part. After the firsttrench is formed, the second mask-material-layer part is removed, and asecond trench is formed in the remaining mask material layer. Comparedwith a solution in which the first trench and the second trench areformed in a same step, in the embodiments of the present disclosure, thefirst trench and the second trench are separately formed. In one aspect,the process window for forming the first trench and the second trench isincreased, so that the pattern precision of the first trench and thesecond trench is ensured. In another aspect, an etching selection ratioof the second mask-material-layer part to the first mask-material-layerpart is relatively large, so that the process window for forming thesecond trench is further increased, thereby ensuring the patternprecision of the second trench. In conclusion, in the embodiments of thepresent disclosure, the pattern precision of the first trench and thesecond trench is improved. Correspondingly, after a to-be-etchedmaterial layer exposed from the first trench and the second trench isremoved to form a target pattern layer, the pattern precision in thetarget pattern layer is correspondingly improved.

To make the foregoing objectives, features, and advantages of theembodiments of the present disclosure more understandable, specificembodiments and implementations of the present disclosure are describedbelow in detail with reference to the accompanying drawings.

FIG. 1 to FIG. 24 are schematic structural diagrams corresponding tosteps in one form of a method for forming a semiconductor structure.

Referring to FIG. 1, a base 100 is provided.

The base 100 is used to provide a process platform for a subsequentprocess. In some implementations, for example, a formed semiconductorstructure is a planar transistor. The base 100 includes a substrate.

Specifically, the substrate is a silicon substrate. In otherimplementations, the material of the substrate may further be germanium,silicon-germanium, silicon carbide, gallium arsenide, indium galliumphosphide, among other materials. The substrate may further be anothertype of substrate such as a silicon-on-insulator substrate or agermanium-on-insulator substrate.

In other implementations, when the formed semiconductor structure is afin field-effect transistor, the base may correspondingly include asubstrate and a fin protruding from the substrate.

The base 100 may further include another structure such as a gatestructure, a doped region, a shallow trench isolation (STI) structure,and a dielectric layer. The gate structure may be a metal gate structureor a polysilicon gate structure.

In some implementations, the base 100 further includes an inter-layerdielectric layer (not shown) formed on the substrate and a contact (CT)hole plug (not shown) formed in the inter-layer dielectric layer.

Continue to refer to FIG. 1. The forming method further includes:forming a dielectric layer 110 on the base 100.

The dielectric layer 110 is used to electrically isolate subsequentlyformed interconnection structures.

In some implementations, the dielectric layer 110 is an inter metaldielectric (IMD) layer, and the dielectric layer 110 is used toelectrically isolate metal interconnection structures in a back end ofline (BEOL) process.

Specifically, the dielectric layer 110 is a first IMD used toelectrically isolate first metal interconnection lines (that is, M1layers). The first metal interconnection line is a metal interconnectionstructure closest to a contact hole plug.

In other implementations, the dielectric layer may further be anotherIMD located on the first metal interconnection line and used toelectrically isolate other interconnection structures. For example, thedielectric layer is a second IMD used to electrically isolate secondmetal interconnection lines and electrically isolate via structureslocated between the second metal interconnection line and the firstmetal interconnection line.

Accordingly, the material of the dielectric layer 110 is a low kdielectric material (the low k dielectric material is a dielectricmaterial having a relative dielectric constant greater than or equal to2.6 and less than or equal to 3.9), an ultra-low k dielectric material(the ultra-low k dielectric material is a dielectric material having arelative dielectric constant less than 2.6), silicon oxide, siliconnitride, silicon oxynitride or the like.

In some implementations, the material of the dielectric layer 110 is anultra-low k dielectric material, to reduce a parasitic capacitancebetween BEOL metal interconnection structures, thereby reducing a BEOLRC delay. Specifically, the ultra-low k dielectric material may beSiOCH.

Continue to refer to FIG. 1. A to-be-etched material layer 120 is formedon the base 100.

After a subsequent patterning process is performed on the to-be-etchedmaterial layer 120, a target pattern that penetrates the thickness ofthe to-be-etched material layer 120 is formed inside the to-be-etchedmaterial layer 120, so as to make process preparation for transfer ofthe target pattern.

In some implementations, the to-be-etched material layer 120 is formedon the dielectric layer 110. The to-be-etched material layer 120 is ahard mask (HM) material layer. That is, the material of the to-be-etchedmaterial layer is an HM material. After the to-be-etched material layer120 is subsequently patterned to form a target pattern layer, the targetpattern layer is used as a mask for patterning the dielectric layer 110.

Accordingly, the material of the to-be-etched material layer 120 mayinclude one or more of silicon oxide, silicon nitride, siliconoxynitride, silicon carbide, titanium, titanium oxide, titanium nitride,tantalum, tantalum oxide, tantalum nitride, boron nitride, coppernitride, aluminum nitride, and tungsten nitride.

In some implementations, the dielectric layer 110 is an IMD layer.Therefore, the to-be-etched material layer 120 is a metal HM (MHM)material layer. Specifically, the material of the to-be-etched materiallayer 120 is titanium nitride. The titanium nitride is a common MHMlayer material in a BEOL process.

In other implementations, the to-be-etched material layer may further bea stacked structure, including a bottom etch stop material layer, an HMmaterial layer located on the bottom etch stop material layer, and a topetch stop material layer located on the HM material layer. The materialsof the bottom etch stop material layer and the top etch stop materiallayer are usually silicon oxide. The bottom etch stop material layer isused to make it less likely to overetch the dielectric layer in theprocess of patterning the HM material layer. The top etch stop materiallayer is used to protect the HM material layer. During patterning of afilm layer located above the HM material layer, it becomes less likelyto overetch the HM material layer. The top etch stop material layer andthe bottom etch stop material layer are used to improve the processwindow and profile control in an etching process.

Continuing to refer to FIG. 1, a mask material layer 130 is formed onthe to-be-etched material layer 120.

A subsequent process includes: patterning the mask material layer 130.The patterned mask material layer 130 is used as a mask for patterningthe to-be-etched material layer 120.

Therefore, an etching selection ratio of the mask material layer 130 tothe to-be-etched material layer 120 is relatively high, so thatselective etching is implemented in a subsequent etching process. Insome implementations, the material of the mask material layer 130 isdifferent from the material of the to-be-etched material layer 120.

In some implementations, the mask material layer 130 is amorphoussilicon (a-Si). The amorphous silicon is a common mask material used forpatterning an MHM material layer in a BEOL process. In otherimplementations, the material of the mask material layer 130 is chosenaccording to the material of the to-be-etched material layer. Thematerial of the mask material layer may further be silicon oxide orsilicon nitride.

With reference to FIG. 2 to FIG. 9, a first doping treatment 133 (asshown in FIG. 8) is performed on a partial region of the mask materiallayer 130. The first doping treatment is suitable for increasing anetching selection ratio of the mask material layer 130 that has notundergone the first doping treatment 133 to the mask material layer 130that has undergone the first doping treatment 133. After the firstdoping treatment 133 is performed, the mask material layer 130 includesa first mask-material-layer part 130 a and a to-be-removed secondmask-material-layer part 130 b. The first mask-material-layer part 130 ais a part that has undergone the first doping treatment 133 in the maskmaterial layer 130.

A subsequent process further includes: forming, in the mask materiallayer 130, a first trench exposing a part of the to-be-etched materiallayer 120, where the first trench is at least located in the firstmask-material-layer part 130 a, after the first trench is formed,removing the second mask-material-layer part 130 b, and forming, in theremaining mask material layer 130, a second trench exposing a part ofthe to-be-etched material layer 120. An etching selection ratio of thesecond mask-material-layer part 130 b to the first mask-material-layerpart 130 a is relatively large, so that the process window for formingthe second trench is significantly increased (for example, the secondmask-material-layer part 130 b may be removed by using masklessetching), and the pattern precision of the formed second trench isensured.

The etching selection ratio of the mask material layer 130 that has notundergone the first doping treatment 133 to the mask material layer 130that has undergone the first doping treatment 133 is a ratio of aremoval rate of the second mask-material-layer part 130 b to a removalrate of the first mask-material-layer part 130 a.

In some implementations, the mask material layer 130 that has undergonethe first doping treatment 133 is used as the first mask-material-layerpart 130 a, and the mask material layer 130 that has not undergone thefirst doping treatment 133 is used as the second mask-material-layerpart 130 b. By using the first doping treatment 133, impurity ions aredoped in a partial region of the mask material layer 130, so that thematerial of the first mask-material-layer part 130 a and the material ofthe second mask-material-layer part 130 b have different microscopicstructures. Specifically, by using the impurity ions, the grain boundaryspacing in silicon in the material of the first mask-material-layer part130 a is reduced, thereby improving the thermal stability and chemicalstability of the first mask-material-layer part 130 a. When thestability is improved, the corrosion resistance capability of the firstmask-material-layer part 130 a is correspondingly improved, so that theetching selection ratio of the second mask-material-layer part 130 b tothe first mask-material-layer part 130 a is increased. In this way, thefirst mask-material-layer part 130 a is less affected by the subsequentprocess of removing the second mask-material-layer part 130 b.

In some implementations, after the first doping treatment 133 isperformed, the etching selection ratio of the second mask-material-layerpart 130 b to the first mask-material-layer part 130 a is greater thanor equal to 6, so that the first mask-material-layer part 130 a is lesslikely to be etched and lost in the subsequent process of forming thesecond trench.

In some implementations, the material of the mask material layer 130 isamorphous silicon. Therefore, doping ions in the first doping treatment133 are B ions. By doping B ions in a part of the amorphous silicon, thematerial of the first mask-material-layer part 130 a turns intoboron-doped silicon, so that the etching selection ratio of the secondmask-material-layer part 130 b to the first mask-material-layer part 130a is significantly increased. Moreover, B atoms are relatively stable,so that the thermal stability and chemical stability of the firstmask-material-layer part 130 a are improved. In addition, B ions arecommon doping ions in the semiconductor field and have relatively highprocess compatibility.

In some implementations, the first doping treatment is performed usingan ion implantation process 133. An ion implantation process isrelatively simple, and by adjusting implantation dosage, it is easy toadjust the etching selection ratio of the second mask-material-layerpart 130 b to the first mask-material-layer part 130 a.

Specifically, the step of the first doping treatment 133 includes thefollowing step.

FIG. 6 is a top view, and FIG. 7 is a sectional view along a sectionline BB1 in FIG. 6. A first pattern layer 320 is formed on the maskmaterial layer 130 (as shown in FIG. 1).

The first pattern layer 320 blocks a partial region of the mask materiallayer 130 to prevent impurity ions in the subsequent first dopingtreatment from being doped in the region. In some implementations, thematerial of the first pattern layer 320 is a photoresist. The firstpattern layer 320 is formed using a photolithography process.

It should be noted that before the first pattern layer 320 is formed,the method further includes: forming a first flattened layer 300 on themask material layer 130; and forming a first anti-reflective coating 310on the first flattened layer 300. The first pattern layer 320 iscorrespondingly formed on the first anti-reflective coating 310.

The first flattened layer 300 is used to provide a flat surface forforming the first pattern layer 320, thereby improving the patternprecision of the first pattern layer 320, so that the topography, size,and formation position of the first pattern layer 320 satisfy processrequirements. In some implementations, the material of the firstflattened layer 300 is a spin-on-carbon (SOC) material. In otherimplementations, the material of the first flattened layer may furtherbe an organic dielectric layer (ODL) material or a deep ultravioletlight absorbing oxide (DUO) material.

The first anti-reflective coating 310 is used to mitigate a reflectioneffect during exposure, thereby improving the precision of patterntransfer. In some implementations, the first anti-reflective coating 310is a Si-ARC layer. The Si-ARC layer helps to increase the exposure depthof field (DOF) during the photolithography process, thereby helping toimprove exposure uniformity. Moreover, the Si-ARC layer is rich insilicon, and therefore further helps to increase the hardness of thefirst anti-reflective coating 310, thereby helping to further improvingthe precision of pattern transfer.

Accordingly, the forming method further includes: sequentially etchingthe first anti-reflective coating 310 and the first flattened layer 300using the first pattern layer 320 as a mask, so as to expose the maskmaterial layer 130 to be doped.

In other implementations, the first pattern layer may further be formedby using a self-aligned double patterning (SADP) process. The density ofthe pattern formed by using the SADP process may be twice that of thepattern formed using a photolithography process without changing acurrent photolithography technology (that is, the size of aphotolithographic window is kept unchanged). To be specific, half of theminimum pitch can be obtained. In this way, as the critical dimension(CD) of a pattern keeps decreasing, the photolithography process exceedsthe resolution limit of photolithography, so that the process of formingthe first pattern layer becomes less difficult and the pattern precisionof the first pattern layer is improved.

Referring to FIG. 8, by using an ion implantation process, the firstdoping treatment 133 is performed on the mask material layer 130 exposedfrom the first pattern layer 320 (as shown in FIG. 7).

After the first doping treatment 133 is performed, the mask materiallayer 130 exposed from the first pattern layer 320 is doped withimpurity ions and used as the first mask-material-layer part 130 a, andthe mask material layer 130 that is not doped with impurity ions is usedas the second mask-material-layer part 130 b.

The implantation dosage for the first doping treatment 133 shouldneither be excessively low nor excessively high. When the implantationdosage is lower, the doping concentration of impurity ions in the firstmask-material-layer part 130 a is correspondingly lower, and the etchingselection ratio of the second mask-material-layer part 130 b to thefirst mask-material-layer part 130 a can hardly satisfy processrequirements. If the implantation dosage is excessively high, the dopingconcentration of impurity ions in the first mask-material-layer part 130a is corresponding excessively high, and impurity ions in the firstmask-material-layer part 130 a diffuses easily into the firstmask-material-layer part 130 a to affect the etching selection ratio ofthe second mask-material-layer part 130 b to the firstmask-material-layer part 130 a and correspondingly affect thetopographic quality of the subsequent second trench. Accordingly, insome implementations, the implantation dosage for the first dopingtreatment 133 is 1E14 atoms per square centimeter to 1E16 atoms persquare centimeter.

The implantation energy for the first doping treatment 133 shouldneither be excessively low nor excessively high. If the implantationenergy is excessively low, it is difficult to ensure that the maskmaterial layer 130 is doped with the impurity ions in the entirethickness range. During subsequent removal of the secondmask-material-layer part 130 b, the mask material layer 130 in theregion corresponding to the first mask-material-layer part 130 a iseasily susceptible to loss. If the implantation energy is excessivelylarge, the impurity ions are likely to be implanted into theto-be-etched material layer 120 below the mask material layer 130. As aresult, the to-be-etched material layer 120 is adversely affected, andcorrespondingly subsequent processes cannot be normally performed.Accordingly, in some implementations, the implantation energy for thefirst doping treatment 133 is 1 Key to 10 Key.

An angle between the implantation direction of the first dopingtreatment 133 and the normal of the surface of the base 100 should notbe excessively large. If the angle is excessively large, the impurityions are likely to be doped accidentally into the first pattern layer320 below the mask material layer 130. As a result, subsequently, thesecond mask-material-layer part 130 b is removed less effectively.Accordingly, in some implementations, the angle between the implantationdirection of the first doping treatment 133 and the normal of thesurface of the base 100 is 0 degrees to 45 degrees. Specifically, whenthe doping ions in the first doping treatment 133 are B ions, the anglemay be 0 degrees. To be specific, the implantation direction isperpendicular to the surface of the base 100.

FIG. 9 is a top view. After the first doping treatment 133 is performed,the first pattern layer 320 (as shown in FIG. 8), the firstanti-reflective coating 310 (as shown in FIG. 8), and the firstflattened layer 300 (as shown in FIG. 8) are removed.

It should be noted that in other implementations, in the process ofsequentially etching the first anti-reflective coating and the firstflattened layer using the first pattern layer as a mask, the firstpattern layer is susceptible to loss. After the mask material layer tobe doped is exposed, the first pattern layer has been completelyconsumed. In this case, only the first anti-reflective coating and thefirst flattened layer need to be removed.

It should further be noted that in some implementations, after the firstdoping treatment 133 is performed, the second mask-material-layer part130 b has a bar-shaped cross section. An extension direction of thesecond mask-material-layer part 130 b is the direction X, and adirection perpendicular to the extension direction of the secondmask-material-layer part 130 b is the direction Y.

With reference to FIG. 2 to FIG. 5, the method further includes: beforethe first doping treatment 133 (as shown in FIG. 8), performing a seconddoping treatment 131 (as shown in FIG. 4) on a partial region of themask material layer 130 (as shown in FIG. 3), where the first dopingtreatment is suitable for increasing an etching selection ratio of themask material layer 130 that has not undergone the second dopingtreatment 131 to the mask material layer 130 that has undergone thesecond doping treatment 131, where the mask material layer 130 that hasundergone the second doping treatment 131 is used as a thirdmask-material-layer part 130 c (as shown in FIG. 5).

The third mask-material-layer part 130 c is used as a cut feature forthe subsequently formed second trench. After the first doping treatment133 is subsequently completed, the third mask-material-layer part 130 cis used to divide the second mask-material-layer part 130 b (as shown inFIG. 9), so that after the second mask-material-layer part 130 b isremoved subsequently, a plurality of isolated second trenches are formedin the remaining mask material layer 130.

An etching selection ratio of the third mask-material-layer part 130 cto the remaining mask material layer 130 that is not doped with ions isrelatively large. Therefore, when the second mask-material-layer part130 b is subsequently removed, the third mask-material-layer part 130 ccan be kept, so that the process window for forming the second trench iscorrespondingly increased, and the pattern precision of the formedsecond trench is ensured. The etching selection ratio of the maskmaterial layer 130 that has not undergone the second doping treatment131 to the mask material layer 130 that has undergone the second dopingtreatment 131 is a ratio of a removal rate of the mask material layer130 that has not undergone the second doping treatment 131 to a removalrate of the third mask-material-layer part 130 c.

In some implementations, after the second doping treatment 131 isperformed, the etching selection ratio of the third mask-material-layerpart 130 c to the remaining mask material layer 130 that is not dopedwith impurity ions is greater than or equal to 6, so that the thirdmask-material-layer part 130 c is less likely to be etched and lost inthe subsequent process of forming the second trench.

A subsequent process further includes: removing the firstmask-material-layer part 130 a (as shown in FIG. 9) and the thirdmask-material-layer part 130 c. Therefore, during actual manufacturing,parameters of the first doping treatment 133 and the second dopingtreatment 131 are appropriately set, so that while it is ensured thatthe etching selection ratio satisfies process requirements, in thesubsequent step of removing the remaining mask material layer 130, anetching selection ratio of the first mask-material-layer part 130 a tothe third mask-material-layer part 130 c may be approximately 1 (forexample, 0.8 to 1.2) to facilitate the removal of the firstmask-material-layer part 130 a and the third mask-material-layer part130 c in a same step, so as to simplify process steps.

In some implementations, doping ions in the second doping treatment 131are the same as the doping ions in the first doping treatment 133, sothat the subsequent step of removing the remaining mask material layer130, it is easy to reduce a difference between removal rates of thefirst mask-material-layer part 130 a and the third mask-material-layerpart 130 c to facilitate the removal of the first mask-material-layerpart 130 a and the third mask-material-layer part 130 c in a same step.

In some implementations, the doping ions in the second doping treatment131 are B ions.

In some implementations, the second doping treatment is performed byusing an ion implantation process 131. An ion implantation process isrelatively simple, and the etching selection ratio of the thirdmask-material-layer part 130 c to the remaining mask material layer 130that is not doped with impurity ions may be adjusted by adjusting theimplantation dosage.

Specifically, the step of the second doping treatment 131 includes thefollowing step.

FIG. 2 is a top view, and FIG. 3 is a sectional view along a sectionline AA1 in FIG. 2. A second pattern layer 220 is formed on the maskmaterial layer 130 (as shown in FIG. 3).

A first pattern opening 225 (as shown in FIG. 3) is formed in the secondpattern layer 220. The first pattern opening 225 exposes a partialregion of the mask material layer 130 and is used to define a region forsubsequently doping impurity ions into the mask material layer 130. Insome implementations, the material of the second pattern layer 220 is aphotoresist.

Therefore, as shown in FIG. 3, before the second pattern layer 220 isformed, the method further includes: forming a second flattened layer200 on the mask material layer 130; and forming a second anti-reflectivecoating 210 on the second flattened layer 200. The second pattern layer220 is correspondingly formed on the second anti-reflective coating 210.

In some implementations, the material of the second flattened layer 200is SOC, and the second anti-reflective coating 210 is a Si-ARC layer.Refer to the foregoing detailed description of the first flattened layer300 (as shown in FIG. 8) and the first anti-reflective coating 310 (asshown in FIG. 8) respectively for the detailed description of the secondflattened layer 200 and the second anti-reflective coating 210, anddetails are not described herein again.

Accordingly, the forming method further includes: sequentially etchingthe second anti-reflective coating 210 and the second flattened layer200 by using the second pattern layer 220 as a mask, so as to expose themask material layer 130 to be doped.

Referring to FIG. 4, the second doping treatment 131 is performed on themask material layer 130 exposed from the first pattern opening 225 byusing an ion implantation process.

After the second doping treatment 131, the mask material layer 130exposed from the first pattern opening 225 is used as the thirdmask-material-layer part 130 c.

In some implementations, both an etching selection ratio of the thirdmask-material-layer part 130 c to the subsequent secondmask-material-layer part 130 b and the etching selection ratio of thesubsequent first mask-material-layer part 130 a to the thirdmask-material-layer part 130 c are considered and impurity ions areprevented from diffusing into a region in which doping is not intended,the implantation dosage of the second doping treatment 131 is 1E14 atomsper square centimeter to 1E16 atoms per square centimeter. Refer to theforegoing corresponding description of the second doping treatment 131for the analysis of the implantation dosage, as details are notdescribed herein again.

In some implementations, to ensure that the mask material layer 130 isdoped with the impurity ions within the entire thickness in a region tobe doped and the impurity ions are less likely to be implanted into theto-be-etched material layer 120, the implantation energy of the seconddoping treatment 131 is 1 Key to 10 Key. Refer to the foregoingcorresponding description of the second doping treatment 133 for theanalysis of the implantation energy, and details are not describedherein again.

The first pattern opening 225 usually has a relatively small openingsize. If the angle is excessively large, the shadow effect is severe toreduce a doping effect. Accordingly, in some implementations, the anglebetween the implantation direction of the second doping treatment 131and the normal of the surface of the base 100 is 0 degrees to 45degrees. Specifically, the angle may be 0 degrees. To be specific, theimplantation direction is perpendicular to the surface of the base 100.Refer to the foregoing corresponding description of the second dopingtreatment 133 for the analysis of the angle, and details are notdescribed herein again.

Refer to the foregoing corresponding description of the first dopingtreatment 133 (as shown in FIG. 8) for the detailed description of thesecond doping treatment 131, as details are not described herein again.

FIG. 5 is a top view. After the second doping treatment 131 (as shown inFIG. 4) is performed, the second pattern layer 220 (as shown in FIG. 4),the second anti-reflective coating 210 (as shown in FIG. 4), and thesecond flattened layer 200 (as shown in FIG. 4) are removed.

Accordingly, continue to refer to FIG. 9. In some implementations, afterthe first doping treatment 133 is performed, the firstmask-material-layer part 130 a is connected to the thirdmask-material-layer part 130 c, and the mask material layer 130corresponding to a region defined by the first mask-material-layer part130 a and the third mask-material-layer part 130 c is the secondmask-material-layer part 130 b, that is, the third mask-material-layerpart 130 c penetrates the second mask-material-layer part 130 b.

Accordingly, a plurality of isolated second mask-material-layer parts130 b are obtained by performing the first doping treatment 133 and thesecond doping treatment 131, so as to provide a process basis forsubsequently forming a plurality of isolated second trenches.

Correspondingly, continue to refer to FIG. 6. In the step of forming thefirst pattern layer 320, the first pattern layer 320 traverses the thirdmask-material-layer part 130 c, where in an extension direction of thethird mask-material-layer part 130 c, and a side wall of the firstpattern layer 320 near a side of a border of the thirdmask-material-layer part 130 c is level with the border of the thirdmask-material-layer part 130 c.

Because impurity ions have been doped in the third mask-material-layerpart 130 c, in the extension direction of the first pattern layer 320,the first pattern layer 320 does not need to expose the mask materiallayer 130 in the region corresponding to the third mask-material-layerpart 130 c, so that the process of forming the first pattern layer 320correspondingly becomes less difficult and the process window forforming the first pattern layer 320 is increased, thereby improving thepattern precision of the first pattern layer 320.

In some implementations, in the extension direction of the thirdmask-material-layer part 130 c, the side wall of the first pattern layer320 near a side of the border of the third mask-material-layer part 130c is level with the border of the third mask-material-layer part 130 c,so that it is ensured that the third mask-material-layer part 130 c canbe connected to the first mask-material-layer part 130 a, therebyisolating the third mask-material-layer part 130 c from the secondmask-material-layer part 130 b.

The first pattern layer 320 exposes a part of the thirdmask-material-layer part 130 c. However, because the first dopingtreatment 133 is used to increase the etching selection ratio of themask material layer 130 that has not undergone the first dopingtreatment 133 to the mask material layer 130 that has undergone thefirst doping treatment 133, even if a part of the thirdmask-material-layer part 130 c is doped with impurity ions through thefirst doping treatment 133, in the subsequent step of removing thesecond mask-material-layer part 130 b, the third mask-material-layerpart 130 c can still be kept.

In other implementations, the first pattern layer may also expose theborder of the third mask-material-layer part. That is, the thirdmask-material-layer part and the first mask-material-layer part have anoverlapping portion. In this case, the third mask-material-layer partcan still be isolated from the second mask-material-layer part, and inthe subsequent step of removing the second mask-material-layer part 130b, the third mask-material-layer part 130 c can still be kept.

It should be noted that in other implementations, the first dopingtreatment may alternatively be performed before the second dopingtreatment is performed.

With reference to FIG. 10 to FIG. 13, after the first doping treatment133 (as shown in FIG. 8) is performed, a first trench 136 (as shown inFIG. 12) exposing a part of the to-be-etched material layer 120 isformed in the mask material layer 130 (as shown in FIG. 12), and thefirst trench 136 is at least located in the first mask-material-layerpart 130 a.

The first trench 136 is used to define a partial region to be removed inthe to-be-etched material layer 120.

In a subsequent process, the second mask-material-layer part 130 b isfurther removed, and the second trench exposing a part of theto-be-etched material layer 120 is formed in the remaining mask materiallayer 130. Compared with a solution in which the first trench and thesecond trench are formed in a same step, in some implementations, thefirst trench 136 and the second trench are separately formed, so thatthe process window for forming the first trench 136 and the secondtrench is increased (for example, optical proximity effects aremitigated), and the pattern precision of the first trench 136 and thesecond trench is ensured.

The mask material layer 130 has not been patterned before the firsttrench 136 is formed, so that a flat surface is provided for forming thefirst trench 136, and correspondingly the process of forming the firsttrench 136 becomes less complex.

Specifically, the step of forming the first trench 136 includes thefollowing step.

FIG. 10 is a top view, and FIG. 11 is a sectional view along a sectionline CC1 in FIG. 10. A third pattern layer 420 is formed on the maskmaterial layer 130.

A second pattern opening 425 is formed in the third pattern layer 420,the second pattern opening 425 exposes a partial region of the maskmaterial layer 130, and the second pattern opening 425 is used to definea formation region for the subsequent first trench. In someimplementations, the material of the third pattern layer 420 is aphotoresist.

Therefore, as shown in FIG. 11, before the third pattern layer 420 isformed, the method further includes: forming a third flattened layer 400on the mask material layer 130; and forming a third anti-reflectivecoating 410 on the third flattened layer 400. The third pattern layer420 is correspondingly formed on the third anti-reflective coating 410.

In some implementations, the material of the third flattened layer 400is SOC, and the third anti-reflective coating 410 is a Si-ARC layer.Refer to the foregoing detailed description of the first flattened layer300 (as shown in FIG. 7) and the first anti-reflective coating 310 (asshown in FIG. 7) respectively for the detailed description of the thirdflattened layer 400 and the third anti-reflective coating 410, anddetails are not described herein again.

Correspondingly, the forming method further includes: sequentiallyetching the third anti-reflective coating 410 and the third flattenedlayer 400 using the third pattern layer 420 as a mask, so as to exposethe mask material layer 130 to be etched.

The mask material layer 130 has a flat surface. Therefore, the processesof forming and patterning the third pattern layer 420, the thirdanti-reflective coating 410, and the third flattened layer 400 becomeless complex.

In some implementations, the second pattern opening 425 traverses thethird mask-material-layer part 130 c. A same second pattern opening 425not only exposes the first mask-material-layer part 130 a on a side ofthe second mask-material-layer part 130 b but also exposes a part of thethird mask-material-layer part 130 c and a part of the secondmask-material-layer part 130 b located on two sides of the thirdmask-material-layer part 130 c, thereby reducing the subsequent pitchbetween the adjacent first trench and second trench and satisfying acomplexity requirement of an IC design.

In other implementations, according to requirements of an IC design, asame second pattern opening may only expose the firstmask-material-layer part on a side of the second mask-material-layerpart. Alternatively, when the third mask-material-layer part and thefirst mask-material-layer part have an overlapping portion, the samesecond pattern opening may also only expose the firstmask-material-layer part and the third mask-material-layer part on aside of the second mask-material-layer part.

FIG. 12 is a top view, and FIG. 13 is a sectional view along a sectionline CC1 in FIG. 12. The mask material layer 130 exposed from the secondpattern opening 425 (as shown in FIG. 11) is etched, and the firsttrench 136 is formed in the mask material layer 130.

In some implementations, the mask material layer 130 exposed from thesecond pattern opening 425 is etched using a dry etching process. Thedry etching process has an anisotropic etching characteristic, so thatthe topographic quality of the first trench 136 is improved. Moreover,the dry etching process is chosen, so that it is easy to control an etchstop position, so as to reduce damage inflicted to the to-be-etchedmaterial layer 120. In addition, parameters of the dry etching processare adjusted appropriately, so that it is easy to etch the firstmask-material-layer part 130 a, the second mask-material-layer part 130b, and the third mask-material-layer part 130 c in a same etching step.

In some implementations, after the first trench 136 is formed, anextension direction of the first trench 136 is the same as the extensiondirection (the direction X shown in FIG. 12) of the secondmask-material-layer part 130 b, and in a direction (the direction Yshown in FIG. 12) perpendicular to the extension direction of the secondmask-material-layer part 130 b, the first trench 136 is located at aboundary between the first mask-material-layer part 130 a and the secondmask-material-layer part 130 b.

Specifically, the first trench 136 further penetrates the thirdmask-material-layer part 130 c.

In some implementations, after the first trench 136 is formed, the thirdpattern layer 420 (as shown in FIG. 11), the third anti-reflectivecoating 410 (as shown in FIG. 11), and the third flattened layer 400 (asshown in FIG. 11) are removed.

FIG. 14 is a top view, and FIG. 15 is a sectional view along a sectionline CC1 in FIG. 14. The forming method further includes: forming a sidewall layer 140 on a side wall of the first trench 136.

Subsequently, after the remaining second mask-material-layer part 130 bis removed, the second trench is formed in the remaining mask materiallayer 130. The side wall layer 140 is used to isolate the second trenchfrom the first trench 136, thereby preventing communication between thesecond trench and the first trench 136. Moreover, the pitch between theadjacent second trench and first trench 136 has the designed minimumspace.

Accordingly, an etching selection ratio of the side wall layer 140 tothe second mask-material-layer part 130 b is relatively high, so thatthe side wall layer 140 can be used as a mask for subsequently removingthe remaining second mask-material-layer part 130 b. In someimplementations, the material of the side wall layer 140 is differentfrom the material of the second mask-material-layer part 130 b. Thematerial of the side wall layer 140 is titanium oxide. Etching selectionratios of titanium oxide to amorphous silicon and titanium nitride arerelatively high. In other implementations, the material of the side walllayer 140 is set according to the materials of the to-be-etched materiallayer and the mask material layer. The material of the side wall layermay further be titanium nitride, silicon oxide, silicon nitride, siliconoxynitride or silicon carbide.

Specifically, the step of forming the side wall layer 140 includes:forming a side wall material layer, where the side wall material layerconformally covers the side wall and the bottom of the first trench 136and further covers the top of the mask material layer 130; and removingthe side wall material layer at the bottom of the first trench 136 andthe top of the mask material layer 130, and keeping the side wallmaterial layer on the side wall of the first trench 136 as the side walllayer 140.

Conformal coverage is chosen to form the side wall material layer, sothat the side wall material layer can be etched using maskless etching,so that the process complexity and costs are reduced. In someimplementations, an atomic layer deposition process is chosen to formthe side wall material layer. The atomic layer deposition process hasdesirable step coverage capability and can form a film layer materialhaving relatively high thickness uniformity, so that the formationquality and thickness uniformity of the side wall layer 140 areimproved.

In other implementations, when the first trench is only formed in thefirst mask-material-layer part on a side of the secondmask-material-layer part or is only formed in the firstmask-material-layer part and the third mask-material-layer part on aside of the second mask-material-layer part, the side wall layer may beomitted.

With reference to FIG. 16 to FIG. 21, after the side wall layer 140 isformed, the method further includes: at least forming a passivationlayer 150 (as shown in FIG. 21) in one first trench 136 (as shown inFIG. 21), and in the extension direction (the direction X shown in FIG.21) of the first trench 136, the corresponding remaining to-be-etchedmaterial layer 120 at the bottom of the first trench 136 is exposed fromtwo sides of the passivation layer 150.

The passivation layer 150 is used as a cut feature for the first trench136. In the extension direction of the first trench 136, the passivationlayer 150 covers a partial region of the to-be-etched material layer120, so that the to-be-etched material layer 120 below the passivationlayer 150 is kept in a subsequent etching process. Correspondingly, whenthe pattern of the first trench 136 is transferred to the to-be-etchedmaterial layer 120, isolated patterns can be formed on the to-be-etchedmaterial layer 120. Compared with a solution in which the first trench136 is divided in the extension direction of the first trench 136 usinga photolithography process, in some implementations, the process windowfor forming the first trench 136 is increased, so that the precision ofpattern transfer is improved.

Specifically, the step of forming the passivation layer 150 includes thefollowing step.

FIG. 16 is a top view, FIG. 17 is a sectional view along a section lineAA1 in FIG. 16, and FIG. 18 is a sectional view along a section line CC1in FIG. 16. A sacrifice layer 500 is formed on the to-be-etched materiallayer 120 exposed from the remaining mask material layer 130, and thesacrifice layer 500 further covers the top of the remaining maskmaterial layer 130.

The sacrifice layer 500 is used to provide a process platform forsubsequently forming the passivation layer.

After the passivation layer is formed subsequently, the sacrifice layer500 further needs to be removed. Therefore, the material of thesacrifice layer 500 is an easily removable material. In someimplementations, the sacrifice layer 500 is a SOC material.

The process of patterning the sacrifice layer 500 usually includesformation of a photoresist layer. A SOC material is chosen, so that thepattern precision of the photoresist layer is further improved, therebyimproving the pattern precision of a through groove subsequently formedin the sacrifice layer 500. Refer to the foregoing detailed descriptionof the first flattened layer 300 (as shown in FIG. 7) for the detaileddescription of the sacrifice layer 500, and details are not describedherein again.

In other implementations, the material of the sacrifice layer mayfurther be an ODL material or a bottom anti-reflective coating (BARC)material.

Continue to refer to FIG. 16 to FIG. 18, and refer to FIG. 19 together.FIG. 19 is a sectional view based on FIG. 18. A through groove 550 (asshown in FIG. 19) is formed in the sacrifice layer 500 above a partialregion of the first trench 136 (as shown in FIG. 14), and in a direction(the direction Y shown in FIG. 16) perpendicular to the extensiondirection of the first trench 136, the through groove 550 at leastexposes the corresponding to-be-etched material layer 120 at the bottomof the first trench 136.

Specifically, a fourth anti-reflective coating 510 is formed on thesacrifice layer 500. A fourth pattern layer 520 is formed on the fourthanti-reflective coating 510, where a third pattern opening 525 is formedin the fourth pattern layer 520 and is used to define a region to beetched in the sacrifice layer 500. The fourth anti-reflective coating510 and the sacrifice layer 500 are sequentially etched along the thirdpattern opening 525, and the through groove 550 is formed in thesacrifice layer 500.

In some implementations, the fourth anti-reflective coating 510 is aSi-ARC layer, and the material of the fourth pattern layer 520 is aphotoresist.

In some implementations, after the through groove 550 is formed, in adirection perpendicular to the extension direction of the first trench136, the through groove 550 further exposes the side wall layer 140, sothat an opening size of the third pattern opening 525 is correspondinglyincreased, and the process window for forming the third pattern opening525 is increased. For example, the resolution limit of aphotolithography process is exceeded. In other implementations, thethrough groove may alternatively only expose the to-be-etched materiallayer between side wall layers.

As shown in FIG. 19, in some implementations, after the through groove550 is formed, the fourth pattern layer 520 (as shown in FIG. 18) andthe fourth anti-reflective coating 510 (as shown in FIG. 18) areremoved.

It should be noted that in other implementations, after the fourthanti-reflective coating and the sacrifice layer are sequentially etchedalong the third pattern opening, the fourth pattern layer and the fourthanti-reflective coating may also be completely consumed.Correspondingly, an additional step does not need to be used to removethe fourth pattern layer and the fourth anti-reflective coating.

FIG. 20 is a sectional view based on FIG. 19. The passivation layer 150that fills the through groove 550 is formed.

Specifically, a passivation material layer is filled in the throughgroove 550. The passivation material layer further covers the top of thesacrifice layer 500. An etchback manner is used to remove thepassivation material layer higher than the top of the sacrifice layer500 to keep the passivation material layer in the through groove 550 asthe passivation layer 150.

In some implementations, the material of the passivation layer 150 islow temperature oxide (LTO). The material has relatively high fillingperformance, so that the filling quality of the passivation layer 150 inthe through groove 550 is improved. Moreover, the material is an easilyremovable material, so that the subsequent process of removing thepassivation layer 150 becomes less difficult. Specifically, alow-pressure chemical vapor deposition (LPCVD) process is chosen to formthe passivation layer 150.

In other implementations, the material of the passivation layer mayfurther be SiOC. In other implementations, the material of thepassivation layer may further be silicon oxide formed by using aflowable chemical vapor deposition (FCVD) process or another suitablematerial that may be formed by using an ALD process.

FIG. 21 is a top view. After the passivation layer 150 is formed, thesacrifice layer 500 (as shown in FIG. 20) is removed.

FIG. 22 is a top view based on FIG. 21. The second mask-material-layerpart 130 b (as shown in FIG. 21) is removed, and a second trench 137exposing a part of the to-be-etched material layer 120 is formed in theremaining mask material layer 130.

The second trench 137 is used to define a remaining region to be removedin the subsequent to-be-etched material layer 120.

The etching selection ratio of the second mask-material-layer part 130 bto the first mask-material-layer part 130 a is relatively large, and theetching selection ratio of the third mask-material-layer part 130 c tothe second mask-material-layer part 130 b is also relatively large, sothat the process window for forming the second trench 137 issignificantly increased, and the pattern precision of the formed secondtrench 137 is ensured. Moreover, compared with a solution in which thefirst trench and the second trench are formed in a same step, the firsttrench 136 is formed in another step, so that the process window for aphotolithography process is increased. For example, the resolution limitof the photolithography process is exceeded, so that the patternprecision of both the first trench 136 and the second trench 137 can beimproved. Correspondingly, after the to-be-etched material layer 120exposed from the first trench 136 and the second trench 137 issubsequently removed to form a target pattern layer, the patternprecision in the target pattern layer is correspondingly improved.

In some implementations, the side wall layer 140 is formed on the sidewall of the first trench 136. Therefore, the second mask-material-layerpart 130 b is removed by using the side wall layer 140 as a mask,thereby isolating the second trench 137 from the first trench 136.

In some implementations, the second mask-material-layer part 130 b isremoved using a wet etching process. In the wet etching process, thesecond mask-material-layer part 130 b is removed through chemicalreactions, so as to reduce damage inflicted to the to-be-etched materiallayer 120 exposed from the first trench 136.

In other implementations, an ashing process may alternatively be chosento remove the second mask-material-layer part.

FIG. 23 is a top view based on FIG. 22. The to-be-etched material layer120 (as shown in FIG. 22) exposed from the first trench 136 (as shown inFIG. 22) and the second trench 137 (as shown in FIG. 22) is removed, andthe remaining to-be-etched material layer 120 is used as a targetpattern layer 121.

In some implementations, the to-be-etched material layer 120 is an HMmaterial layer. Correspondingly, the target pattern layer 121 is an HMlayer. The HM layer is used as a mask for subsequently patterning thedielectric layer 110.

After the to-be-etched material layer 120 exposed from the first trench136 and the second trench 137 is removed, the patterns of the firsttrench 136 and the second trench 137 are transferred to the targetpattern layer 121, and a plurality of mask openings 125 are formed inthe target pattern layer 121. The first trench 136 and the second trench137 have relatively high pattern precision, so that the patternprecision of the mask openings 125 is correspondingly improved.

In some implementations, the side wall layer 140 is formed on the sidewall of the first trench 136, and the passivation layer 150 is formed inat least one first trench 136. Therefore, in the step of forming thetarget pattern layer 121, the to-be-etched material layer 120 exposedfrom the first trench 136 and the second trench 137 is removed by usingthe side wall layer 140 and the passivation layer 150 as masks.

In some implementations, after the target pattern layer 121 is formed,the method further includes: removing the side wall layer 140, thepassivation layer 150, and the remaining mask material layer 130.

Specifically, the side wall layer 140, the passivation layer 150, andthe remaining mask material layer 130 are removed using a dry etchingprocess. By adjusting parameters of the dry etching process, the sidewall layer 140, the passivation layer 150, and the remaining maskmaterial layer 130 can be removed on a same etching machine.

FIG. 24 is a top view based on FIG. 23. The forming method furtherincludes: patterning the dielectric layer 110 by using the targetpattern layer 121 (as shown in FIG. 23) as a mask, forming aninterconnection opening (not shown) in the dielectric layer 110, andfilling a conductive material in the interconnection opening, to form aninterconnection structure 160.

The mask openings 125 (as shown in FIG. 23) have relatively high patternprecision, thereby improving the pattern precision of theinterconnection opening, so that the topography and layout of theinterconnection structure 160 satisfy design requirements, andcorrespondingly the performance of the interconnection structure 160 isimproved.

In some implementations, the interconnection structure 160 is a metalinterconnection line in a BEOL process.

The process of forming the interconnection structure 160 usuallyincludes flattening treatment, and the target pattern layer 121 isremoved during the flattening treatment.

As the circuit integration level increases, it becomes increasinglycomplex to design BEOL metal wiring, and the pitch between adjacentmetal interconnection lines keeps decreasing. By using the foregoingmanner of forming the first trench 136 and the second trench 137, theformation quality and performance of the metal interconnection lines aresignificantly improved, thereby improving the performance andreliability of the semiconductor structure. For example, the metalinterconnection line is a first metal (M1) interconnection line.

In other implementations, the dielectric layer may further be aninter-layer dielectric layer, and the interconnection structure iscorrespondingly a contact hole plug.

It should be noted that in other implementations, in the foregoingforming method, after the first doping treatment is performed, thesecond mask-material-layer part is a part that has undergone the firstdoping treatment in the mask material layer.

In some implementations, during the first doping treatment, impurityions damage the lattices of the second mask-material-layer part andreduce the material density of the second mask-material-layer part, sothat the second mask-material-layer part becomes easily removable, andcorrespondingly the etching selection ratio of the secondmask-material-layer part to the first mask-material-layer part can alsobe increased.

Accordingly, in some implementations, in the step of forming the maskmaterial layer on the to-be-etched material layer, the material of themask material layer is silicon oxide or silicon nitride.

When the material of the mask material layer is silicon oxide, thedoping ions in the foregoing first doping treatment are Ar ions. Whenthe material of the mask material layer is silicon nitride, the dopingions in the foregoing first doping treatment are H ions or He ions.

It should be noted that in this case, correspondingly, the foregoingsecond doping treatment does not need to be performed. In the step ofthe foregoing the first doping treatment, a pattern layer (for example,a photoresist layer) only exposes the mask material layer in a regioncorresponding to the second mask-material-layer part that is to beremoved.

Refer to the corresponding description in the implementations describedabove, as details may not be described herein again.

A form of the present disclosure provides a semiconductor structure.FIG. 25 and FIG. 26 are schematic structural diagrams of one form of asemiconductor structure. FIG. 25 is a top view, and FIG. 26 is asectional view along a section line CC1 in FIG. 25.

The semiconductor structure includes: a base 600; a to-be-etchedmaterial layer 620, located on the base 600; a mask material layer 630(as shown in FIG. 25), located on the to-be-etched material layer 620,where the mask material layer 630 includes a first mask-material-layerpart 630 a and a to-be-removed second mask-material-layer part 630 b,the first mask-material-layer part 630 a has doping ions, or, the secondmask-material-layer part 630 b has doping ions; and a trench 636,located in the mask material layer 630, where the trench 636 is at leastlocated in the first mask-material-layer part 630 a.

In some implementations, for example, the semiconductor structure is aplanar transistor. The base 600 includes a substrate. Specifically, thesubstrate is a silicon substrate. In other implementations, the materialof the substrate may further be germanium, silicon-germanium, siliconcarbide, gallium arsenide, indium gallium phosphide, among othermaterials. The substrate may further be another type of substrate suchas a silicon-on-insulator substrate or a germanium-on-insulatorsubstrate.

In other implementations, when the semiconductor structure is a finfield-effect transistor, the base may correspondingly include asubstrate and a fin protruding from the substrate.

The base 600 may further include another structure such as a gatestructure, a doped region, an STI structure, and a dielectric layer. Insome implementations, the base 600 further includes an inter-layerdielectric layer (not shown) located on the substrate and a contact holeplug (not shown) formed in the inter-layer dielectric layer.

In some implementations, the semiconductor structure further includes: adielectric layer 610 located on the base 600.

The dielectric layer 610 is used to electrically isolate interconnectionstructures. In some implementations, the dielectric layer 610 is an IMDlayer and is used to electrically isolate metal interconnectionstructures in a BEOL process.

Specifically, the dielectric layer 610 is a first IMD used toelectrically isolate first metal interconnection lines. The first metalinterconnection line is a metal interconnection structure closest to acontact hole plug. In other implementations, the dielectric layer mayfurther be an IMD located on the first metal interconnection line andused to electrically isolate other interconnection structures. Forexample, the dielectric layer is a second IMD used to electricallyisolate second metal interconnection lines and electrically isolate viastructures located between the second metal interconnection line and thefirst metal interconnection line.

Accordingly, the material of the dielectric layer 610 is a low kdielectric material, an ultra-low k dielectric material, silicon oxide,silicon nitride, silicon oxynitride or the like. In someimplementations, the material of the dielectric layer 610 is anultra-low k dielectric material. Specifically, the ultra-low kdielectric material may be SiOCH.

In other implementations, the dielectric layer may further be aninter-layer dielectric layer and used to electrically isolate thecontact hole plug.

After a patterning process is performed on the to-be-etched materiallayer 620, a target pattern that penetrates the thickness of theto-be-etched material layer 620 is formed inside the to-be-etchedmaterial layer 620. In some implementations, the to-be-etched materiallayer 620 is located on the dielectric layer 610. The to-be-etchedmaterial layer 620 is an HM material layer. That is, the material of theto-be-etched material layer is an HM material. After the to-be-etchedmaterial layer 620 is patterned to form a target pattern layer, thetarget pattern layer is used as a mask for patterning the dielectriclayer 610.

Accordingly, the material of the to-be-etched material layer 620 mayinclude one or more of silicon oxide, silicon nitride, siliconoxynitride, silicon carbide, titanium, titanium oxide, titanium nitride,tantalum, tantalum oxide, tantalum nitride, boron nitride, coppernitride, aluminum nitride, and tungsten nitride.

In some implementations, the dielectric layer 610 is an IMD layer.Therefore, the material of the to-be-etched material layer 620 istitanium nitride. In other implementations, the to-be-etched materiallayer may further be a stacked structure, including a bottom etch stopmaterial layer, an HM material layer located on the bottom etch stopmaterial layer, and a top etch stop material layer located on the HMmaterial layer. The materials of the bottom etch stop material layer andthe top etch stop material layer are usually silicon oxide.

The patterned mask material layer 630 is used as a mask for patterningthe to-be-etched material layer 620.

Therefore, an etching selection ratio of the mask material layer 630 tothe to-be-etched material layer 620 is relatively high, so thatselective etching is implemented in a subsequent etching process. Insome implementations, the material of the mask material layer 630 isdifferent from the material of the to-be-etched material layer 620.

In some implementations, the material of the mask material layer 630 isamorphous silicon. The amorphous silicon is a common mask material usedto pattern an MHM material layer in a BEOL process. In otherimplementations, the material of the mask material layer 630 is setaccording to the material of the to-be-etched material layer. Thematerial of the mask material layer may further be silicon oxide orsilicon nitride.

In some implementations, a trench is formed in the mask material layer630. The trench is at least located in the first mask-material-layerpart 630 a. Specifically, the trench is defined as a first trench 636.The first trench 636 is used to define a partial region to be etched inthe to-be-etched material layer 620. In a subsequent process, a secondtrench exposing a part of the to-be-etched material layer 620 may beformed in the mask material layer 630 by removing the secondmask-material-layer part 630 b. The second trench is used to define aremaining region to be etched in the to-be-etched material layer 620.

In some implementations, ions are doped in the first mask-material-layerpart 630 a, so that the grain boundary spacing in the material in thefirst mask-material-layer part 630 a is reduced, thereby improving thethermal stability and chemical stability of the firstmask-material-layer part 630 a. When the stability is improved, thecorrosion resistance capability of the first mask-material-layer part630 a is correspondingly improved, so that an etching selection ratio ofthe second mask-material-layer part 630 b to the firstmask-material-layer part 630 a is relatively large, and the processwindow for forming the second trench is significantly increased (forexample, the second mask-material-layer part may be removed by usingmaskless etching 630 b), so that the pattern precision of the formedsecond trench is ensured.

Moreover, the first trench 636 and the second trench are formed indifferent steps. Compared with a solution in which the first trench andthe second trench are formed in a same step, in some implementations,the process window for a photolithography process is improved. Forexample, the resolution limit of the photolithography process isexceeded, so that the pattern precision of both the first trench 636 andthe second trench can be improved. Correspondingly, after theto-be-etched material layer 620 exposed from the first trench 636 andthe second trench is subsequently removed to form a target patternlayer, the pattern precision in the target pattern layer iscorrespondingly improved.

In some implementations, the material of the mask material layer 630 isamorphous silicon. Therefore, the doping ions in the firstmask-material-layer part 630 a are B ions. Correspondingly, the materialof the first mask-material-layer part 630 a turns into boron-dopedsilicon, so that the etching selection ratio of the secondmask-material-layer part 630 b to the first mask-material-layer part 630a is significantly increased. Moreover, B atoms are relatively stable,so that the thermal stability and chemical stability of the firstmask-material-layer part 630 a are improved. In addition, B ions arecommon doping ions in the semiconductor field and have relatively highprocess compatibility.

In some implementations, the concentration of the doping ions in thefirst mask-material-layer part 630 a is appropriately set, so that theetching selection ratio of the second mask-material-layer part 630 b tothe first mask-material-layer part 630 a satisfies process requirements,and impurity ions in the first mask-material-layer part 630 a areprevented from diffusing into the first mask-material-layer part 630 a,thereby ensuring topographic quality of the subsequent second trench.

It should be noted that in some implementations, an extension direction(the direction X shown in FIG. 25) of the first trench 636 is the sameas an extension direction of the second mask-material-layer part 630 b,and in a direction (the direction Y shown in FIG. 25) perpendicular tothe extension direction of the second mask-material-layer part 630 b,the first trench 636 is located at a boundary between the firstmask-material-layer part 630 a and the second mask-material-layer part630 b.

The first trench 636 is located at the boundary between the firstmask-material-layer part 630 a and the second mask-material-layer part630 b, so that the pitch between the subsequent adjacent first trench636 and second trench is reduced, and a complexity requirement of an ICdesign is satisfied. In other implementations, according to requirementsof an IC design, the first trench may alternatively be located in thefirst mask-material-layer part on a side of the secondmask-material-layer part.

Accordingly, in some implementations, the semiconductor structurefurther includes: a side wall layer 640, located on a side wall of thefirst trench 636.

The second trench is formed by removing the second mask-material-layerpart 630 b, and the side wall layer 640 is used to isolate the secondtrench from the first trench 636, thereby preventing communicationbetween the second trench and the first trench 636. Moreover, the pitchbetween the adjacent second trench and first trench 636 has the designedminimum space.

Accordingly, an etching selection ratio of the side wall layer 640 tothe second mask-material-layer part 630 b is relatively high, so thatthe side wall layer 640 can be used as a mask for the subsequent removalof the second mask-material-layer part 630 b. In some implementations,the material of the side wall layer 640 is different from the materialof the second mask-material-layer part 630 b. The material of the sidewall layer 640 is titanium oxide. Etching selection ratios of titaniumoxide to amorphous silicon and titanium nitride are relatively high. Inother implementations, the material of the side wall layer 640 is setaccording to the materials of the to-be-etched material layer and themask material layer. The material of the side wall layer may further betitanium nitride, silicon oxide, silicon nitride, silicon oxynitride orsilicon carbide.

In other implementations, when the first trench is located in the firstmask-material-layer part on a side of the second mask-material-layerpart, the side wall layer may also be omitted in the semiconductorstructure.

In some implementations, the mask material layer 630 further includes: athird mask-material-layer part 630 c. In a direction perpendicular tothe extension direction of the second mask-material-layer part 630 b,the third mask-material-layer part 630 c penetrates the secondmask-material-layer part 630 b, and the third mask-material-layer part630 c has doping ions.

The third mask-material-layer part 630 c is used as a cut feature forthe subsequent second trench. The third mask-material-layer part 630 cis used to divide the second mask-material-layer part 630 b, so thatafter the second mask-material-layer part 630 b is removed, a pluralityof isolated second trenches may be formed in the mask material layer630.

An etching selection ratio of the third mask-material-layer part 630 cto the second mask-material-layer part 630 b is relatively large.Therefore, during the removal of the second mask-material-layer part 630b, the third mask-material-layer part 630 c can be kept, so that aplurality of isolated second trenches are formed, the process window forforming the second trench is correspondingly improved, and the patternprecision of the formed second trench is ensured.

In some implementations, doping ions in the third mask-material-layerpart 630 c are the same as the doping ions in the firstmask-material-layer part 630 a, so that in the subsequent step ofremoving the third mask-material-layer part 630 c and the firstmask-material-layer part 630 a, a difference between removal rates ofthe first mask-material-layer part 630 a and the thirdmask-material-layer part 630 c is reduced, and it is easy to remove thefirst mask-material-layer part 630 a and the third mask-material-layerpart 630 c in a same step.

In some implementations, the concentration of the doping ions in thethird mask-material-layer part 630 c is appropriately set, so that theetching selection ratio of the third mask-material-layer part 630 c tothe second mask-material-layer part 630 b and an etching selection ratioof the third mask-material-layer part 630 c to the firstmask-material-layer part 630 a satisfy process requirements, andimpurity ions in the first mask-material-layer part 630 a are preventedfrom diffusing into another region.

In some implementations, it may be known according to the foregoinganalysis that the doping ions in the third mask-material-layer part 630c are B ions.

According to the type of the doping ions in the thirdmask-material-layer part 630 c and the subsequent firstmask-material-layer part 630 a, the concentration of the doping ions inthe third mask-material-layer part 630 c and the subsequent firstmask-material-layer part 630 a is appropriately set, so that the etchingselection ratio of the third mask-material-layer part 630 c to the firstmask-material-layer part 630 a may be approximately 1 (for example, 0.8to 1.2) to facilitate the removal of the first mask-material-layer part630 a and the third mask-material-layer part 630 c in a same step, so asto simplify process steps.

It should be noted that the semiconductor structure further includes: apassivation layer 650, at least located in one first trench 636, wherein the extension direction of the first trench 636, the correspondingremaining to-be-etched material layer 620 at the bottom of the firsttrench 636 is exposed from two sides of the passivation layer 650.

The passivation layer 650 is used as a cut feature for the first trench.In the extension direction of the first trench 636, the passivationlayer 650 covers a partial region of the to-be-etched material layer620, so that the to-be-etched material layer 620 below the passivationlayer 650 is kept in a subsequent etching process. Correspondingly, whenthe pattern of the first trench 636 is transferred to the to-be-etchedmaterial layer 620, isolated patterns can be formed on the to-be-etchedmaterial layer 620. Compared with a solution in which a photolithographyprocess is used to divide the first trench 636 in the extensiondirection of the first trench 636, in some implementations, the processwindow for forming the first trench 636 is increased, and the precisionof pattern transfer is improved.

In some implementations, the material of the passivation layer 650 isLTO. The material has relatively high filling performance, so that thefilling quality of the passivation layer 650 in the first trench 636 isimproved. Moreover, the material is an easily removable material, sothat the subsequent process of removing the passivation layer 650becomes less difficult. In other implementations, the material of thepassivation layer may further be SiOC.

In some implementations, in a direction perpendicular to the extensiondirection of the first trench 636, the passivation layer 650 furthercovers the corresponding side wall layer 640 on the side wall of thefirst trench 636. The process of forming the passivation layer 650includes a photolithography process. The length of the passivation layer650 is increased, so that the process window in the photolithographyprocess is correspondingly increased. For example, the resolution limitof the photolithography process is exceeded. The length of thepassivation layer 650 is the size of the passivation layer 650 in adirection perpendicular to the extension direction of the first trench636.

In other implementations, the passivation layer may alternatively coveronly the to-be-etched material layer between side wall layers.

It should be noted that some implementations are described using anexample in which the first mask-material-layer part 630 a has dopingions. In other implementations, alternatively, the secondmask-material-layer part has doping ions, and the firstmask-material-layer part correspondingly does not have doping ions.

In the semiconductor field, ion doping is usually used, so that thesecond mask-material-layer part has doping ions. During ion doping, thedoping ions damage the lattices of the second mask-material-layer partand reduce the material density of the second mask-material-layer part,so that the second mask-material-layer part becomes easily removable,and correspondingly the etching selection ratio of the secondmask-material-layer part to the first mask-material-layer part can alsobe increased.

Accordingly, in some implementations, the material of the mask materiallayer is correspondingly silicon oxide or silicon nitride.

When the material of the mask material layer is silicon oxide, thesecond mask-material-layer part has doping ions, and the doping ions areAr ions. Alternatively, when the material of the mask material layer issilicon nitride, the second mask-material-layer part has doping ions,and the doping ions are H ions or He ions.

It should be noted that in this case, the semiconductor structurecorrespondingly does not include a third mask-material-layer part. Theremaining part other than the second mask-material-layer part in themask material layer is used as the first mask-material-layer part.

Refer to the corresponding description in the implementations describedabove, as details may not be described herein again.

The semiconductor structure in some currently-described implementationsmay be formed using the forming method in the implementations describedabove or may be formed using another forming method. Refer to thecorresponding description in the implementations described above, asdetails may not be described herein again.

The present disclosure is described above, but the present disclosure isnot limited thereto. A person skilled in the art may make variousvariations and changes without departing from the spirit and scope ofthe present disclosure. Therefore, the protection scope of the presentdisclosure should be as defined by the claims.

What is claimed is:
 1. A method for forming a semiconductor structure,comprising: providing a base; forming a to-be-etched material layer onthe base; forming a mask material layer on the to-be-etched materiallayer; performing a first doping treatment on a partial region of themask material layer, wherein: the first doping treatment is suitable forincreasing an etching selection ratio of the mask material layer thathas not undergone the first doping treatment to the mask material layerthat has undergone the first doping treatment, after the first dopingtreatment is performed, the mask material layer comprises a firstmask-material-layer part and a to-be-removed second mask-material-layerpart, and the first mask-material-layer part is a part that hasundergone the first doping treatment in the mask material layer, or, thesecond mask-material-layer part is a part that has undergone the firstdoping treatment in the mask material layer; after the first dopingtreatment is performed, forming, in the mask material layer, a firsttrench exposing a part of the to-be-etched material layer, wherein thefirst trench is at least located in the first mask-material-layer part;after the first trench is formed, removing the secondmask-material-layer part, and forming a second trench exposing a part ofthe to-be-etched material layer in the remaining mask material layer;removing the to-be-etched material layer exposed from the first trenchand the second trench, and forming a target pattern layer; and after thetarget pattern layer is formed, removing the remaining mask materiallayer.
 2. The method for forming a semiconductor structure according toclaim 1, wherein in the step of forming a first trench, an extensiondirection of the first trench is the same as an extension direction ofthe second mask-material-layer part, and in a direction perpendicular tothe extension direction of the second mask-material-layer part, thefirst trench is located at a boundary between the firstmask-material-layer part and the second mask-material-layer part; beforethe second mask-material-layer part is removed, the method furthercomprises: forming a side wall layer on a side wall of the first trench;and in the step of forming a second trench, removing the secondmask-material-layer part by using the side wall layer as a mask; and inthe step of forming a target pattern layer, removing the to-be-etchedmaterial layer exposed from the first trench and the second trench byusing the side wall layer as a mask.
 3. The method for forming asemiconductor structure according to claim 2, wherein the material ofthe side wall layer is titanium oxide, titanium nitride, silicon oxide,silicon nitride, silicon oxynitride or silicon carbide.
 4. The methodfor forming a semiconductor structure according to claim 2, wherein theprocess of forming the side wall layer comprises an atomic layerdeposition process.
 5. The method for forming a semiconductor structureaccording to claim 1, wherein: after the first doping treatment isperformed, the first mask-material-layer part is a part that hasundergone the first doping treatment in the mask material layer; and inthe step of forming a mask material layer on the to-be-etched materiallayer, the material of the mask material layer is amorphous silicon; orafter the first doping treatment is performed, the secondmask-material-layer part is a part that has undergone the first dopingtreatment in the mask material layer; and in the step of forming a maskmaterial layer on the to-be-etched material layer, the material of themask material layer is silicon oxide or silicon nitride.
 6. The methodfor forming a semiconductor structure according to claim 1, wherein thematerial of the mask material layer is amorphous silicon, and dopingions in the first doping treatment are B ions; or the material of themask material layer is silicon oxide, and doping ions in the firstdoping treatment are Ar ions; or the material of the mask material layeris silicon nitride, and doping ions in the first doping treatment are Hions or He ions.
 7. The method for forming a semiconductor structureaccording to claim 1, wherein: the first doping treatment is performedusing an ion implantation process, and parameters of the first dopingtreatment comprise: implantation energy of 1 Key to 10 Key, implantationdosage of 1E14 atoms per square centimeter to 1E16 atoms per squarecentimeter, and an implantation direction at an angle of 0 degrees to 45degrees from the normal of the surface of the base.
 8. The method forforming a semiconductor structure according to claim 1, wherein thesecond mask-material-layer part is removed using a wet etching processor an ashing process.
 9. The method for forming a semiconductorstructure according to claim 1, wherein: after the first dopingtreatment is performed, the first mask-material-layer part is a partthat has undergone the first doping treatment in the mask materiallayer; before the first trench is formed, the forming method furthercomprises: performing a second doping treatment on a partial region ofthe mask material layer, wherein the second doping treatment is suitablefor increasing an etching selection ratio of the mask material layerthat has not undergone the second doping treatment to the mask materiallayer that has undergone the second doping treatment, and the maskmaterial layer that has undergone the second doping treatment is used asa third mask-material-layer part; and after the first doping treatmentand the second doping treatment are performed, the firstmask-material-layer part is connected to the third mask-material-layerpart, and the mask material layer corresponding to a region defined bythe first mask-material-layer part and the third mask-material-layerpart is the second mask-material-layer part.
 10. The method for forminga semiconductor structure according to claim 9, wherein the seconddoping treatment is performed before the first doping treatment isperformed; or, the first doping treatment is performed before the seconddoping treatment is performed.
 11. The method for forming asemiconductor structure according to claim 9, wherein doping ions in thesecond doping treatment are the same as doping ions in the first dopingtreatment.
 12. The method for forming a semiconductor structureaccording to claim 9, wherein doping ions in the second doping treatmentare B ions.
 13. The method for forming a semiconductor structureaccording to claim 9, wherein the second doping treatment is performedusing an ion implantation process, where parameters of the second dopingtreatment comprise: implantation energy of 1 Key to 10 Key, implantationdosage of 1E14 atoms per square centimeter to 1E16 atoms per squarecentimeter, and an implantation direction at an angle of 0 degrees to 45degrees from the normal of the surface of the base.
 14. The method forforming a semiconductor structure according to claim 9, wherein: thesecond doping treatment is performed before the first doping treatmentis performed; and the step of performing a first doping treatment on apartial region of the mask material layer comprises: forming a patternlayer on the mask material layer, wherein the pattern layer traversesthe third mask-material-layer part, wherein in an extension direction ofthe third mask-material-layer part, and the pattern layer exposes theborder of the third mask-material-layer part, or, a side wall of thepattern layer near a side of the border of the third mask-material-layerpart is level with the border of the third mask-material-layer part;performing the first doping treatment on the mask material layer exposedfrom the pattern layer; and removing the pattern layer.
 15. The methodfor forming a semiconductor structure according to claim 1, whereinafter the first doping treatment is performed, the firstmask-material-layer part is a part that has undergone the first dopingtreatment in the mask material layer; and the step of performing a firstdoping treatment on a partial region of the mask material layercomprises: forming a pattern layer on the mask material layer using aphotolithography process or a self-aligned double patterning (SADP)process; performing the first doping treatment on the mask materiallayer exposed from the pattern layer; and removing the pattern layer.16. The method for forming a semiconductor structure according to claim1, wherein the mask material layer is etched using a dry etchingprocess, and the first trench is formed in the mask material layer. 17.The method for forming a semiconductor structure according to claim 1,wherein: the method further comprises: after the first trench is formed,and before the second trench is formed, forming at least a passivationlayer in one first trench, wherein in an extension direction of thefirst trench, the corresponding remaining to-be-etched material layer atthe bottom of the first trench is exposed from two sides of thepassivation layer; and in the step of forming a target pattern layer,the to-be-etched material layer exposed from the first trench and thesecond trench is removed using the passivation layer as a mask.
 18. Themethod for forming a semiconductor structure according to claim 17,wherein: the step of forming a passivation layer comprises: forming asacrifice layer on the to-be-etched material layer exposed from theremaining mask material layer, wherein the sacrifice layer covers thetop of the remaining mask material layer; forming a through groove inthe sacrifice layer above a partial region of the first trench, whereinin a direction perpendicular to the extension direction of the firsttrench, the through groove at least exposes the correspondingto-be-etched material layer at the bottom of the first trench; formingthe passivation layer that fills the through groove; and after thepassivation layer is formed, removing the sacrifice layer.
 19. Themethod for forming a semiconductor structure according to claim 17,wherein the material of the passivation layer is LTO or SiOC.
 20. Themethod for forming a semiconductor structure according to claim 1,wherein: in the step of forming a to-be-etched material layer on thebase, the to-be-etched material layer comprises a hard mask (HM)material layer; the method further comprises: before the to-be-etchedmaterial layer is formed on the base, forming a dielectric layer on thebase; and after the remaining mask material layer is removed, patterningthe dielectric layer by using the target pattern layer as a mask, andforming an interconnection opening in the dielectric layer; and fillinga conductive material in the interconnection opening, to form aninterconnection structure.
 21. The method for forming a semiconductorstructure according to claim 20, wherein the interconnection structureis a metal interconnection line or a contact hole plug.